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Study on Delamination Between Polymer Materials and Metals in IC Packaging Process.

Cheng-Tang Pan1,2, Shao-Yu Wang3, Chung-Kun Yen4

  • 1Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 804, Taiwan. pan@mem.nsysu.edu.tw.

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Summary
This summary is machine-generated.

This study reduced electronic package delamination in low-profile fine pitch ball grid array (LFBGA) and plastic ball grid array (PBGA) packages. Methods included surface treatments and design optimization, significantly decreasing material failure.

Keywords:
FEALFBGAPBGAXPScontact angledelamination

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Area of Science:

  • Materials Science and Engineering
  • Electronic Packaging Reliability
  • Surface Chemistry

Background:

  • Package delamination is a critical failure mode in electronic components.
  • Low-profile fine pitch ball grid array (LFBGA) and plastic ball grid array (PBGA) packages are widely used but susceptible to delamination.
  • Understanding the interplay between material properties and interfacial adhesion is crucial for enhancing package reliability.

Purpose of the Study:

  • To investigate and mitigate delamination in LFBGA and PBGA electronic packages.
  • To explore the impact of surface properties and bonding mechanisms on package integrity.
  • To optimize package design for improved thermal management and reduced stress concentrations.

Main Methods:

  • Characterization of LFBGA package properties: surface roughness, surface energy, and contact angle.
  • Ar + O2 gas plasma treatment to enhance adhesive properties of metal surfaces (Cu, Ni, Cr).
  • Surface composition analysis using X-ray photoelectron spectroscopy (XPS).
  • Finite element analysis (FEA) using ANSYS to simulate PBGA packaging and stress distribution.
  • Design optimization of PBGA corner seat (chamfer design, shoulder length, width, and radius).

Main Results:

  • Surface roughness and energy were characterized, and their relationship with delamination was established.
  • Gas plasma treatment successfully enhanced adhesive properties.
  • FEA simulations identified stress concentration points in PBGA packaging.
  • A new chamfer design for the PBGA corner seat significantly reduced stress values and delamination.
  • Increased shoulder length and optimized chamfer radius/width led to reduced stress.

Conclusions:

  • Surface treatments and design modifications are effective in reducing electronic package delamination.
  • Optimizing geometric parameters like shoulder length and chamfer radius is critical for mitigating stress in PBGA packages.
  • This research provides valuable insights for improving the reliability and longevity of electronic packaging materials.