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    Area of Science:

    • Semiconductor manufacturing
    • Optical microscopy
    • Machine learning

    Background:

    • Optical image quality is degraded by diffraction and noise, complicating nanoscale defect detection.
    • Acquiring sufficient high-quality training data for rare defects is often prohibitively expensive.
    • Existing machine learning methods require large datasets and face challenges with simulations.

    Purpose of the Study:

    • To present a novel interpretable machine learning technique for classifying nanoscale defects in semiconductor wafer images.
    • To address challenges in defect detection, including noise, limited training data, and computational complexity.
    • To enable accurate detection, classification, and size estimation of nanoscale defects.

    Main Methods:

    • Developed an interpretable machine learning technique incorporating physical insights specific to noisy optical images.
    • Utilized a small number of training samples for defect classification.
    • Applied the method to analyze semiconductor wafers using visible light microscopy.

    Main Results:

    • Successfully detected both parallel and previously undetectable perpendicular bridge defects in a 9-nm node wafer.
    • Accurately classified the shapes of nanoscale defects.
    • Provided reliable estimations of defect sizes from optical images.

    Conclusions:

    • The proposed machine learning technique offers an effective solution for detecting and classifying nanoscale defects in semiconductor manufacturing.
    • This approach overcomes the limitations of traditional methods requiring extensive training data and complex simulations.
    • The technique enhances defect analysis capabilities, particularly for rare and critical defects.