Polymer thin film adhesion utilizing the transition from surface wrinkling to delamination

Understanding the adhesion of rigid thin films to compliant substrates is critical for the development and implementation of flexible electronic devices and wearable sensor technologies. Quantifying the strength of a film-substrate interface can be challenging due to the brittleness of glassy films which can greatly complicate sample preparation, handling, and testing. Here, a method for measuring the adhesion of glassy thin films to soft elastomeric substrates is explored that exploits an understanding of surface buckling instabilities, specifically the transition from wrinkling to delamination. The adhesion (given by the critical strain energy release rate (G_c)) for two model materials' interfaces is quantified by determining the critical delamination strain for thin glassy polymer films (polystyrene (PS) and poly(methyl methacrylate) (PMMA)) from an elastomeric substrate (poly(dimethyl siloxane) (PDMS)). By accounting for edge defects that greatly reduce the critical strain for delamination, reasonable adjusted G_c values of 21.0 ± 5.1 mJ m^-2 and 32.2 ± 4.9 mJ m^-2 are found for PS-PDMS and PMMA-PDMS interfaces, respectively. The utilization of this method to characterize film modulus and adhesion could be used as a facile measurement technique for more applied polymer thin film systems.