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Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and

Yu-An Shen1, Chun-Ming Lin2,3, Jiahui Li4,5

  • 1Joining and Welding Research Institute (JWRI), Osaka University, Osaka, 5600047, Japan. yashen@jwri.osaka-u.ac.jp.

Scientific Reports
|July 17, 2019
PubMed

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