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Updated: Jan 21, 2026

Residue-Free Fabrication of van der Waals Heterostructures of Two-Dimensional Materials
Published on: July 18, 2025
Versatile Electronic Devices Based on WSe2/SnSe2 Vertical van der Waals Heterostructures
Wei Li1, Xiang Xiao1, Huilong Xu1
1HiSilicon Research Department , Huawei Technologies Co. Ltd ., Shenzhen 518129 , P. R. China.
High-performance electronic devices utilize vertically stacked tungsten diselenide and tin diselenide. These van der Waals heterostructures offer exceptional on/off ratios and rectification, paving the way for advanced electronics.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Van der Waals heterostructures are promising for electronic applications.
- Current devices based on these heterostructures lag behind established technologies.
- Novel materials and device architectures are needed to improve performance.
Purpose of the Study:
- To develop high-performance electronic devices using vertically stacked 2D materials.
- To investigate the electrical characteristics of tungsten diselenide/tin diselenide heterostructures.
- To demonstrate the potential of these heterostructures in electronic circuits.
Main Methods:
- Fabrication of van der Waals heterostructures by vertically stacking tungsten diselenide and tin diselenide.
- Electrical characterization of the heterostructure devices.
- Demonstration of a rectifier circuit using the fabricated diodes.
Main Results:
- Achieved a high current on/off ratio of approximately 3 × 10^8.
- Observed an average subthreshold slope of 126 mV/dec due to band-to-band tunneling.
- Demonstrated an ultrahigh rectification ratio of approximately 3 × 10^8.
- Reached a current density exceeding 10^4 A/cm^2.
- Successfully implemented a rectifier circuit.
Conclusions:
- Vertically stacked WSe2/SnSe2 heterostructures exhibit excellent electronic properties.
- The unique band alignment and atomic thickness enable effective electrical field modulation.
- These devices show great potential for future high-speed electronic applications.
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