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Updated: Jan 21, 2026

Preparation of Binary and Ternary Deep Eutectic Systems
Published on: October 31, 2019
High rate laser deposition of conductive copper microstructures from deep eutectic solvents
Andrey Shishov1, Dmitry Gordeychuk1, Lev Logunov1
1Institute of Chemistry, Saint-Petersburg University, Saint Petersburg State University, SPbSU, SPbU, 7/9 Universitetskaya nab., St. Petersburg 199034, Russia. andrey.shishov.rus@gmail.com.
Abstract:
In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.
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