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Preparation of Binary and Ternary Deep Eutectic Systems
Published on: October 31, 2019
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High rate laser deposition of conductive copper microstructures from deep eutectic solvents
Andrey Shishov1, Dmitry Gordeychuk1, Lev Logunov1
1Institute of Chemistry, Saint-Petersburg University, Saint Petersburg State University, SPbSU, SPbU, 7/9 Universitetskaya nab., St. Petersburg 199034, Russia. andrey.shishov.rus@gmail.com.
Chemical Communications (Cambridge, England)
|July 27, 2019
Summary
Laser chemical deposition of copper was achieved using deep eutectic solvents (DESs) on dielectric substrates. This novel method significantly simplifies copper deposition and increases the rate by over 150 times compared to aqueous solutions.
Area of Science:
- Materials Science
- Chemical Engineering
- Surface Science
Background:
- Traditional copper deposition methods can be complex and slow.
- Dielectric substrates require specialized deposition techniques.
- Deep eutectic solvents (DESs) offer unique properties for chemical processes.
Purpose of the Study:
- To demonstrate laser chemical deposition of copper on dielectric substrates using DESs for the first time.
- To evaluate the efficiency and rate enhancement of DES-assisted deposition.
- To establish a simplified and faster method for copper metallization.
Main Methods:
- Laser-induced chemical deposition.
- Utilizing deep eutectic solvents (DESs) as the deposition medium.
- Copper deposition onto a dielectric substrate.
Main Results:
- Successful deposition of copper on a dielectric substrate using laser-assisted chemical methods.
- Demonstration of the feasibility of using DESs for this process.
- Achieved a deposition rate increase of over 150 times compared to aqueous solutions.
- Simplified the overall metal deposition procedure.
Conclusions:
- Laser chemical deposition of copper using DESs is a novel and highly efficient method.
- DESs significantly enhance the deposition rate and simplify the process for dielectric substrates.
- This technique offers a promising alternative for copper metallization in various applications.
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