Contact Photolithography at Sub-Micrometer Scale Using a Soft Photomask.
Chun-Ying Wu1, Heng Hsieh1, Yung-Chun Lee2
1Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan.
Micromachines
|August 21, 2019
Summary
A novel soft polydimethylsiloxane (PDMS) photomask improves contact photolithography resolution to the sub-micrometer scale. This method enables high-pattern resolution for microfabrication applications.
Area of Science:
- Materials Science
- Nanotechnology
- Microfabrication
Background:
- Conventional contact photolithography faces limitations in achieving sub-micrometer patterning resolution.
- The development of advanced photomask technologies is crucial for next-generation microelectronic devices.
Purpose of the Study:
- To propose and demonstrate a new method for enhancing photolithography patterning resolution.
- To achieve sub-micrometer feature sizes using a novel soft photomask approach.
Main Methods:
- Fabrication of a soft polydimethylsiloxane (PDMS) photomask replicated from a silicon mold.
- Patterning the PDMS photomask with a black photoresist (PR) layer to selectively block ultraviolet (UV) light.
- Utilizing the soft PDMS photomask for intimate contact photolithography on a PR-coated substrate.
Main Results:
- Successful fabrication of the black-PR/PDMS soft photomask.
- Achieved UV patterning with a minimum line-width of 170 nm over a 4-inch wafer area.
- Demonstrated high pattern resolution capabilities of the soft photomask in contact photolithography.
Conclusions:
- The developed black-PR/PDMS soft photomask effectively enhances contact photolithography resolution.
- This technique offers a viable pathway for sub-micrometer patterning, with potential applications in advanced microfabrication.
- The conformable nature of the soft mask ensures high fidelity pattern transfer.
Keywords:
black photoresistcontact photolithographysoft photomasksub-micrometer scaleultraviolet patterningMore Related Videos
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