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Updated: Jan 20, 2026

Application of Light-cured Dental Adhesive Resin for Mounting Electrodes or Microdialysis Probes in Chronic Experiments
Published on: July 30, 2007
Polybenzoxazines: Thermal Responsiveness of Hydrogen Bonds and Application as Latent Curing Agents for Thermosetting
Shuai Zhang1, Po Yang1, Yun Bai1
1State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering and State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute, Sichuan University, Chengdu 610065, China.
Abstract:
This work aims at exploring the application of polybenzoxazines as thermal latent curing agents for epoxy resins. Thorough studies have shown that hydrogen bonds of polybenzoxazines block the reactivity of phenolic hydroxyl at ambient temperatures and break at elevated temperatures to release the free phenolic hydroxyl. On the basis of these findings, polybenzoxazines are used as thermal latent curing agents. Mixtures of polybenzoxazines and epoxy resins exhibit a long shelf life at room temperature, and the corresponding copolymers possess enhanced properties. This novel insight into using polybenzoxazines as thermal latent curing agents for epoxy resins is anticipated to help researchers explore novel latent curing agents and apply polybenzoxazines more widely.
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