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Updated: Jan 20, 2026

Polymeric Microneedle Array Fabrication by Photolithography
Published on: November 17, 2015
Shape Transformation Photolithography: Self-Assembled Arrays of Suspended MEMS Structures from Patterned Polymer
Andriy Sherehiy1, Jeremy M Rathfon1, Hiroya Abe1,2
1ElectroOptics Research Institute and Nanotechnology Center, University of Louisville, Louisville, Kentucky 40292, United States.
Shape transformation photolithography (STP) fabricates suspended fibers by directing capillary forces. This novel method enables arbitrary patterns and high-speed production of microscale fiber arrays.
Area of Science:
- Materials Science
- Nanotechnology
- Mechanical Engineering
Background:
- Traditional methods for suspended micromechanical structures risk damage from capillary forces during solvent removal.
- Existing capillary force-directed fabrication methods have limitations in manufacturing speed and pattern flexibility.
Purpose of the Study:
- To introduce Shape Transformation Photolithography (STP) for fabricating arbitrarily patterned arrays of suspended fibers.
- To demonstrate a method capable of high fabrication rates for suspended fiber structures.
Main Methods:
- STP involves prepatterning holes in a polymer nanofilm on a micropillar array.
- Heating the film above its glass transition temperature causes holes to expand via dewetting.
- Capillary forces then thin polymer channels, forming suspended fibers.
Main Results:
- Prepatterning ensures simultaneous fiber formation with uniform diameters by overcoming nucleation energy barriers.
- Arrays of fibers and lattice networks were successfully fabricated from dyed polystyrene films using nanosecond laser pulses.
- The exposure threshold for hole formation is compatible with existing wafer-stepping projection printers.
Conclusions:
- STP offers a versatile and potentially high-throughput method for creating complex suspended fiber structures.
- The technique overcomes limitations of previous fabrication methods, enabling arbitrary patterning.
- STP shows promise for integration into industrial manufacturing processes for microdevices.
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