Related Experiment Video
Updated: Jan 20, 2026
Fabrication of Nanopillar-Based Split Ring Resonators for Displacement Current Mediated Resonances in Terahertz Metamaterials
Published on: March 23, 2017
One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal
Shang Wang1, Yanhong Tian1, Chenxi Wang1
1State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
Abstract:
By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA uniformly filled the pores of AAO with a pore-filling percentage of 99.4%, as the ion concentration in AAO pores can re-equilibrate to electrolyte concentration during the current-off period. The CuNPA-filled AAO film showed a high thermal conductivity of 153.12 W/(m·K) in the vertical direction and a low thermal conductivity of 3.43 W/(m·K) in the horizontal direction. Hence, the anisotropic ratio of the thermal conductivity reached 44.64. Moreover, the fabrication process was facile and cost-effective, showing a potential application prospect in the field of high-density packages and power electronic devices.
More Related Videos
10:27Fabrication of Nano-engineered Transparent Conducting Oxides by Pulsed Laser Deposition
Published on: February 27, 2013
11:24Fabrication of Gradient Nanopattern by Thermal Nanoimprinting Technique and Screening of the Response of Human Endothelial Colony-forming Cells
Published on: July 1, 2018
Related Concept Videos
10:28Fabrication of Nanopillar-Based Split Ring Resonators for Displacement Current Mediated Resonances in Terahertz Metamaterials
10:27Fabrication of Nano-engineered Transparent Conducting Oxides by Pulsed Laser Deposition
11:24Fabrication of Gradient Nanopattern by Thermal Nanoimprinting Technique and Screening of the Response of Human Endothelial Colony-forming Cells
08:21Fabrication of Periodic Gold Nanocup Arrays Using Colloidal Lithography
06:53Fabrication and Optimization of Type II Silicon Clathrate Films
06:46A Performance-testing Platform for a Conduction Micropump with an FR-4 Copper-clad Electrode Plate