Three-Dimensional Analysis of Strain
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Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Renliang Yuan1, Jiong Zhang2, Jian-Min Zuo1
1Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, United States.
This study introduces an improved Scanning Electron NanoDiffraction (SEND) method for precise lattice strain mapping in nanomaterials. The enhanced technique achieves 1 nm resolution and high strain precision, crucial for nano-device analysis.
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