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A 3D-printed Chamber for Organic Optoelectronic Device Degradation Testing
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Surface condensation sensor board for damp heat chamber.

Ashwin Vijayasai1, Qianhuan Yu2, Yan Du1

  • 1R&D Reliability Department, Lumentum Inc., 400 N. Mc Carthy Blvd., Milpitas, California 94560, USA.

The Review of Scientific Instruments
|October 3, 2019
PubMed
Summary

This study introduces a surface condensation sensor board to map humidity variations within damp heat chambers. This helps identify safer locations for testing sensitive electronic and optical components.

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Environmental Science

Background:

  • Damp heat testing is crucial for electronic component reliability.
  • Understanding spatial humidity variations in chambers is challenging.
  • Current methods lack precise spatial characterization of condensation.

Purpose of the Study:

  • To develop and validate a sensor board for characterizing interior space in damp heat chambers.
  • To identify localized condensation spots and less-risky testing locations.
  • To improve the reliability and accuracy of component qualification processes.

Main Methods:

  • A custom sensor board (18 in. × 12 in.) with 324 sense electrodes (250 μm gap) was designed.
  • Surface leakage current was measured and correlated with humidity.
  • Spatially resolved measurements identified condensation hot spots under 85 °C/85%RH conditions.

Main Results:

  • The sensor board effectively characterized surface leakage current in relation to humidity.
  • Localized condensation spots were successfully identified within the damp heat chamber.
  • A spatial map of humidity-induced risk was generated.

Conclusions:

  • The surface condensation sensor board is a viable tool for characterizing chamber environments.
  • Identifying less-risky locations enhances the reliability of component qualification.
  • This method provides critical data for optimizing damp heat testing protocols.