Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix.

Area of Science:

• Materials Science
• Electrical Engineering
• Electronics Manufacturing

Background:

• Conventional electronics rely on rigid printed circuit boards (PCBs) with multiple metallization layers.
• Current stretchable electronics often lack multilayer capabilities, hindering complex interconnections.
• Developing reliable stretchable printed circuit board (SPCB) methods for crossovers and vertical interconnects is a significant challenge.

Purpose of the Study:

• To present an industry-compatible manufacturing method for producing multilayer stretchable printed circuit boards (SPCBs).
• To enable reliable crossovers and vertical interconnects within an elastomeric matrix for stretchable electronics.
• To demonstrate a functional stretchable active matrix with integrated devices capable of significant deformation.

Main Methods:

• Development of an industry-compatible manufacturing process for SPCBs.
• Integration of multilayer metallization for crossovers and vertical interconnects.
• Fabrication of a stretchable active matrix incorporating electronic and optoelectronic surface mount devices.

Main Results:

• Successful implementation of a novel SPCB manufacturing method.
• Demonstration of multilayer crossovers and vertical interconnects in a stretchable format.
• Creation of a stretchable (260%) active matrix that reversibly deforms into various 3D shapes.

Conclusions:

• The developed method establishes a reliable approach for manufacturing multilayer SPCBs.
• This advancement facilitates the creation of complex, deformable 3D electronic systems.
• The technology enables integration of diverse electronic and optoelectronic components into stretchable form factors.