Related Experiment Video
Updated: Jan 4, 2026
Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
Cotton Candy-Templated Fabrication of Three-Dimensional Ceramic Pathway within Polymer Composite for Enhanced Thermal
Yuming Wu1,2,3, Kai Ye1, Zhiduo Liu1,2
1Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering , Chinese Academy of Sciences , Ningbo 315201 , China.
Abstract:
With the minimization and higher power of electronic devices, materials with effective heat dissipation and high electrical insulation have attracted relentless interest. Especially, highly thermally conductive, highly electrically insulating but low filler content of polymer-based composites are desirable. Herein, a facile and eco-friendly cotton candy-templated method (CTM) to construct three-dimensional heat transport pathways inside epoxy resin is reported. The fabricated Al2O3/epoxy composites with enhanced heat transport capability feature a 15-fold increase in thermal conductivity at a filler content of 36.2 vol % compared to pristine epoxy. Moreover, the remarkable thermal conductive property has excellent stability over a wide range of temperature before and after heating and cooling cycles. Meanwhile, the CTM composite still retain highly electrical insulation. The cotton candy-templated method proposed in this work is a new avenue for the preparation of three-dimensional heat transport pathways within polymer-based composites for microelectronic packaging and electrical engineering systems.
