Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Tiny integrated lasers and their application to industrial laser technologies: feature issue introduction.

Optics express·2026
Same author

Thermal conductivity of transparent Y<sub>2</sub>O<sub>3</sub>, YAG, YSAG, and YGAG ceramics compared to YAG and sapphire single crystals.

Optics express·2025
Same author

Fatigue strength enhancement of structural members via in situ laser peening using TILA for service life extension.

Optics express·2025
Same author

High-energy, strong-field deep-ultraviolet based joule-class amplifier with distributed-faced-cooling chips.

Optics letters·2025
Same author

Nd<sup>3+</sup>-doping in Al<sup>3+</sup>-site of <i>α</i>-Al<sub>2</sub>O<sub>3</sub> as a raw material of Nd:sapphire laser ceramics.

Optics express·2025
Same author

Diode-pumped microchip laser from neodymium doped calcium borosilicate glass.

Optics express·2025

Related Experiment Video

Updated: Jan 4, 2026

Low-cost Custom Fabrication and Mode-locked Operation of an All-normal-dispersion Femtosecond Fiber Laser for Multiphoton Microscopy
08:48

Low-cost Custom Fabrication and Mode-locked Operation of an All-normal-dispersion Femtosecond Fiber Laser for Multiphoton Microscopy

Published on: November 22, 2019

7.9K

>30 MW peak power from distributed face cooling tiny integrated laser.

Lihe Zheng, Arvydas Kausas, Takunori Taira

    Optics Express
    |November 6, 2019
    PubMed
    Summary
    This summary is machine-generated.

    This study presents a novel tiny integrated laser using Distributed Face Cooling (DFC) chip technology. The DFC chip enables high peak power lasers for applications like laser-armed robots.

    More Related Videos

    Construction and Characterization of External Cavity Diode Lasers for Atomic Physics
    09:10

    Construction and Characterization of External Cavity Diode Lasers for Atomic Physics

    Published on: April 24, 2014

    28.4K
    Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography
    11:34

    Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

    Published on: May 15, 2017

    11.5K

    Related Experiment Videos

    Last Updated: Jan 4, 2026

    Low-cost Custom Fabrication and Mode-locked Operation of an All-normal-dispersion Femtosecond Fiber Laser for Multiphoton Microscopy
    08:48

    Low-cost Custom Fabrication and Mode-locked Operation of an All-normal-dispersion Femtosecond Fiber Laser for Multiphoton Microscopy

    Published on: November 22, 2019

    7.9K
    Construction and Characterization of External Cavity Diode Lasers for Atomic Physics
    09:10

    Construction and Characterization of External Cavity Diode Lasers for Atomic Physics

    Published on: April 24, 2014

    28.4K
    Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography
    11:34

    Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

    Published on: May 15, 2017

    11.5K

    Area of Science:

    • Optics and Photonics
    • Materials Science
    • Laser Technology

    Background:

    • Conventional bulk lasers face challenges with heat dissipation, limiting performance and integration.
    • Advanced cooling techniques are crucial for developing compact, high-power laser systems.

    Purpose of the Study:

    • To develop and demonstrate a tiny integrated laser utilizing Distributed Face Cooling (DFC) chip technology.
    • To evaluate the thermal management advantages of the DFC chip compared to traditional laser designs.

    Main Methods:

    • Fabrication of a DFC chip by bonding Nd:YAG plates with sapphire heat spreaders using surface activated bonding (SAB) at room temperature.
    • Integration of a Cr4+:YAG saturable absorber for pulsed laser operation.
    • Finite element analysis (FEA) to assess heat dissipation efficiency.

    Main Results:

    • Achieved a sub-nanosecond pulsed DFC-chip tiny integrated laser with 21.5 mJ output energy and 32.3 MW peak power.
    • Demonstrated superior heat dissipation of the DFC chip over conventional bulk-chip designs via FEA.
    • Confirmed the experimental feasibility of the SAB-DFC-chip for high peak power, tiny integrated laser applications.

    Conclusions:

    • The SAB-DFC-chip enables the creation of compact, high-peak-power lasers with efficient thermal management.
    • This technology paves the way for ubiquitous laser systems, including those for robotic applications.