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A cross-interface model for thermal transport across the interface between overlapped nanoribbons
Wentao Feng1, Xiaoxiang Yu2, Yue Wang2
1State Key Laboratory of Coal Combustion, Huazhong University of Science and Technology, Wuhan 430074, P. R. China. dengcc@hust.edu.cn nuo@hust.edu.cn and School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China.
Physical Chemistry Chemical Physics : PCCP
|November 7, 2019
Summary
A new cross-interface model (CIM) explains 2D heat transport in low-dimensional materials. Thermal resistances and factor η significantly impact heat dissipation, aiding thermal management applications.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Effective heat dissipation is crucial for low-dimensional materials in electronics.
- Understanding thermal transport at cross-interfaces is essential for composite materials and devices.
Purpose of the Study:
- To develop an analytical model for 2D thermal transport at cross-interfaces.
- To investigate the influence of thermal resistances and factor η on heat transport.
Main Methods:
- Proposed a novel analytical model: the cross-interface model (CIM).
- Validated CIM using molecular dynamics simulations on boron nitride nanoribbon interfaces.
Main Results:
- CIM accurately models 2D thermal transport at cross-interfaces.
- Identified thermal resistances and factor η as key factors influencing thermal transport.
- Demonstrated the model's applicability for overlapped boron nitride nanoribbons.
Conclusions:
- The cross-interface model (CIM) provides a deeper understanding of thermal transport mechanisms.
- Findings facilitate the application of low-dimensional materials in advanced thermal management solutions.
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