Effectiveness of Ligand Denticity-Dependent Oxidation Protection in Copper MOD Inks.
W Marchal1,2, F Mattelaer3, K Van Hecke4
1Institute for Materials Research (IMO-IMOMEC) , UHasselt-Hasselt University , Wetenschapspark 1 , 3950 Diepenbeek , Belgium.
Langmuir : the ACS Journal of Surfaces and Colloids
|November 8, 2019
Summary
Copper inks offer cost benefits but face oxidation challenges. This study shows bidentate ligands improve copper protection during curing, enhancing conductivity for flexible electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Chemistry
Background:
- The shift to copper-based inks for flexible electronics is driven by cost but hindered by copper's high oxidation sensitivity.
- Oxidation degrades copper ink conductivity and device performance during and after the curing process.
Purpose of the Study:
- To investigate the impact of ligand choice on copper oxide formation during metal organic decomposition (MOD) ink curing.
- To identify strategies for preserving copper integrity and conductivity in printed electronics.
Main Methods:
- Utilized a variety of in situ characterization techniques to monitor ink decomposition.
- Analyzed the role of different ligands in protecting copper during the curing process.
Main Results:
- Bidentate ligands were found to provide a superior oxidation barrier compared to other ligand types.
- Despite ligand protection, copper oxidation can still occur depending on curing time and atmospheric conditions.
Conclusions:
- Ligand selection is crucial for mitigating copper oxidation in MOD inks.
- Further research into ambient-curable copper MOD inks can benefit from these insights into oxidation mechanisms.
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