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Enhancement of the Initial Growth Rate of Agricultural Plants by Using Static Magnetic Fields
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Effect of static magnetic field on mold corrosion of printed circuit boards

Jirui Wang1, Ziheng Bai1, Kui Xiao1

  • 1Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, PR China; National Materials Corrosion and Protection Data Center, University of Science and Technology Beijing, Beijing 100083, PR China.

Bioelectrochemistry (Amsterdam, Netherlands)
|November 12, 2019
PubMed

Keywords:
Copper-clad plateCorrosion mechanismMagnetic fieldMold, corrosion

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