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The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements
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217
Calibration of thermocouple-based scanning thermal microscope in active mode (2ω method).
T P Nguyen1, L Thiery1, S Euphrasie1
1Institut FEMTO-ST, UMR 6174, CNRS, ENSMM, Univ. Bourgogne Franche-Comté, 15B, Avenue des Montboucons, 25030 Besancon Cedex, France.
The Review of Scientific Instruments
|November 30, 2019
Summary
This study calibrates a scanning thermal microscopy probe for solid thermal conductivity measurements. The probe
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Analysis
Background:
- Accurate measurement of solid material thermal conductivity is crucial for various applications.
- Scanning thermal microscopy (STM) offers high-resolution thermal property mapping.
- Calibration of STM probes is essential for reliable quantitative measurements.
Purpose of the Study:
- To present a calibration procedure for a scanning thermal microscopy probe.
- To investigate the probe's thermal interaction with solid samples in different environments.
- To determine the measurement range and uncertainty of the technique.
Main Methods:
- Utilized a microthermocouple wire probe on a quartz tuning fork in active and modulated modes.
- Performed measurements on reference samples in vacuum and ambient air.
- Employed analytical modeling based on heat equation resolution and thermal conductance networks.
Main Results:
- Observed distinct differences in probe-sample thermal interaction between vacuum and ambient air.
- Found that the effective thermal contact radius is sample-dependent in air but constant in vacuum.
- Established a measurement range, with maximum measurable thermal conductivities of ~23 W m⁻¹ K⁻¹ (vacuum) and ~37 W m⁻¹ K⁻¹ (air).
Conclusions:
- The developed calibration procedure enables accurate thermal conductivity measurements of solids.
- Environmental conditions significantly influence the probe-sample thermal interaction and measurement accuracy.
- The technique provides lowest uncertainties for materials with thermal conductivity below 5 W m⁻¹ K⁻¹.

