A fast and versatile method for spectral emissivity measurement at high temperatures
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Updated: Jan 3, 2026

Emission Spectroscopic Boundary Layer Investigation during Ablative Material Testing in Plasmatron
Published on: June 9, 2016
Abdelmagid El Bakali1, Rémi Gilblas1, Thomas Pottier1
1Institut Clément Ader (ICA), Université de Toulouse, CNRS, IMT Mines Albi, INSA, ISAE-SUPAERO, UPS, Campus Jarlard, F-81013 Albi, France.
Abstract:
In this paper, the development of a new device for high temperature emissivity measurement is described. This device aims at measuring both spectral and total emissivity for a thermal range of 600-1000 °C. The main targeted properties of this device are versatility and simplicity. To achieve this, a rigorous selection of components such as heating systems, heat sources, sample holders, and measuring devices was made. Sample dimensions and the corresponding sample holder were optimized through a ray tracing model computation. Selection of sensors to compute the total emissivity was also discussed. A near-infrared (NIR) spectrometer and two mid-infrared (MIR) cameras equipped with optical filters covering the bandwidth of 3-5 and 7.5-13 μm were chosen for spectral measurements. The major impediment was the separation of the sample signal and various spurious signals emitted by the environment. A specific measurement methodology was then made for each bandwidth to resolve this issue. Platinum was chosen as the reference material for the device validation. Spectral emissivity measurements were then compared to values from a commercial spectrometer. A good agreement was found between NIR and MIR band I measurements, and a higher error rate was seen in MIR band II which is explained by a less favorable signal to noise ratio. Integrated emissivity is then calculated and compared to values found in the literature. A good agreement between these values is found, and similar trends with temperature are observed. The device is then validated for spectral and total emissivity measurements. Device versatility and simplicity allow for an easy adaptation to a large area of applications.
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