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Biodegradable Flexible Substrate Based on Chitosan/PVP Blend Polymer for Disposable Electronics Device Applications.
Ritesh Kumar1, Sapana Ranwa2, Gulshan Kumar1
1University School of Basic and Applied Sciences , Guru Gobind Singh Indraprastha University , New Delhi 110078 , India.
The Journal of Physical Chemistry. B
|December 7, 2019
Summary
Researchers developed a biodegradable chitosan/PVP substrate for flexible electronics. This low-cost, eco-friendly material exhibits excellent optical and mechanical properties, paving the way for sustainable electronic devices.
Area of Science:
- Materials Science
- Polymer Science
- Electronics Engineering
Background:
- Growing demand for sustainable electronics necessitates the use of natural and biodegradable materials.
- Traditional flexible electronics often rely on non-biodegradable and costly components.
- Developing eco-friendly substrates is crucial for reducing the environmental impact of electronic devices.
Purpose of the Study:
- To fabricate a low-cost, biodegradable, and flexible substrate for electronic applications using natural and synthetic polymers.
- To evaluate the properties of the developed chitosan/PVP (CHP) substrate for its suitability in flexible electronics.
- To demonstrate the performance of a metal-semiconductor-metal (MSM) device fabricated on the CHP substrate.
Main Methods:
- Fabrication of chitosan/PVP (CHP) substrate using a solution casting method.
- Characterization of CHP substrate's optical transmittance, thermal stability, surface morphology, mechanical properties, and biodegradation rate.
- Deposition of zinc oxide (ZnO) thin films and gold/titanium (Au/Ti) electrodes using radio frequency (RF) sputtering and thermal evaporation.
- Fabrication and testing of a metal-semiconductor-metal (MSM) device on the CHP substrate, including current-voltage measurements under flat and bending conditions.
Main Results:
- The CHP substrate exhibited high optical transmittance (~90% in the visible region) and good thermal stability (up to 250 °C).
- The substrate demonstrated a smooth surface, good mechanical stability, and a high biodegradation rate (within 6 days).
- The fabricated MSM device showed stable current conduction over multiple flat-bending-flat cycles, indicating the substrate's reliability.
Conclusions:
- The developed chitosan/PVP substrate is a viable, low-cost, and environmentally friendly option for flexible electronics.
- The CHP substrate's properties support its use in fabricating high-performance, sustainable electronic devices.
- This work presents a promising pathway towards greener and more sustainable flexible electronic technologies.
