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Updated: Jan 2, 2026

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Study of the Degree of Cure through Thermal Analysis and Raman Spectroscopy in Composite-Forming Processes
Juan A García-Manrique1, Bernabé Marí1, Amparo Ribes-Greus1
1Institute of Design for Manufacturing and Automated Production, Universitat Politècnica de València (UPV), Camí de Vera s/n, 46022 València, Spain.
Abstract:
The curing of composite materials is one of the parameters that most affects their mechanical behavior. The inspection methods used do not always allow a correct characterization of the curing state of the thermosetting resins. In this work, Raman spectroscopy technology is used for measuring the degree of cure. The results are compared with conventional thermal gravimetric analysis (TGA), differential scanning calorimetry (DSC), and scanning electron microscope (SEM). Carbon fiber specimens manufactured with technologies out of autoclave (OoA) have been used, with an epoxy system Prepreg System, SE 84LV. The results obtained with Raman technology show that it is possible to verify the degree of polymerization, and the information is complementary from classical thermal characterization techniques such as TGA and DSC; thus, it is possible to have greater control in curing and improving the quality of the manufactured parts.
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