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Published on: January 31, 2019
Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics
Xin Wang1, Feirong Huang1, Dongxing Wang2
1School of Materials Science and Engineering, Key Laboratory of Materials Modification by Laser, Ion and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116023, People's Republic of China.
Abstract:
In this work, Ag-Cu and Ag-Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag-Cu or Ag-Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag-Sn NPs exhibit a room-temperature resistivity of 4.24 × 10-5 Ω · cm, a little lower than 7.10 × 10-5 Ω · cm of Ag-Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25-300 K. Ag-Sn NPs exhibit thermally competitive stability up to 230 °C and a lower resistivity of 3.18 × 10-5 Ω · cm after sintering at 200 °C, giving it potential for application in flexible printed electronics.
