Hierarchical crack patterns of metal films sputter deposited on soft elastic substrates

Controlled cracks are useful in a wide range of applications, including stretchable electronics, microfluidics, sensors, templates, biomimics, and surface engineering. Here we report on the spontaneous formation of hierarchical crack patterns in metal (nickel) films sputter deposited on soft elastic polydimethylsiloxane (PDMS) substrates. The experiment shows that the nickel film generates a high tensile stress during deposition, which is relieved by the formation of disordered crack networks (called primary cracks). Due to the strong interfacial adhesion and soft substrate, the cracks can penetrate into the PDMS substrate deeply. The width and depth of the primary cracks both increase with increasing film thickness, whereas the crack spacing is insensitive to the film thickness. The film pieces dividing by the primary cracks can fracture further when they are triggered by an external disturbance due to the residual tensile stress, resulting in the formation of fine crack networks (called secondary cracks). The width and spacing of the secondary cracks show different behaviors in comparison to the primary cracks. The morphological characteristics, growth behaviors, and formation mechanisms of the primary and secondary cracking modes have been discussed in detail. The report in this work could provide better understanding of two distinct cracking modes with different sizes and morphologies.