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High performance waveguide uni-travelling carrier photodiode grown by solid source molecular beam epitaxy.

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    |December 25, 2019
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    Researchers developed the first waveguide-coupled phosphide-based uni-traveling-carrier photodiodes (UTC-PDs) using Solid Source Molecular Beam Epitaxy (SSMBE). This technique offers superior control and avoids issues seen in other growth methods for high-performance photodetectors.

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    Area of Science:

    • Optoelectronics
    • Semiconductor Device Fabrication
    • Materials Science

    Background:

    • Metal Organic Vapour Phase Epitaxy (MOVPE) and Gas Source MBE (GSMBE) are traditional methods for InGaAsP materials.
    • These methods have limitations, including zinc diffusion (MOVPE) and handling toxic gases (GSMBE).
    • Uni-traveling-carrier photodiodes (UTC-PDs) are crucial for high-speed optical communication.

    Purpose of the Study:

    • To report the first waveguide-coupled phosphide-based UTC-PDs grown by Solid Source Molecular Beam Epitaxy (SSMBE).
    • To demonstrate the advantages of SSMBE over MOVPE and GSMBE for UTC-PD fabrication.
    • To characterize the performance of these novel UTC-PDs and their integration with antennas and optical fibers.

    Main Methods:

    • Growth of phosphide-based UTC-PDs using Solid Source Molecular Beam Epitaxy (SSMBE).
    • Integration of UTC-PDs with Coplanar Waveguides (CPW).
    • 3D full-wave electromagnetic modeling for antenna-integrated UTCs and optical coupling analysis.

    Main Results:

    • Achieved UTC-PDs with a 3 dB bandwidth exceeding 65 GHz.
    • Demonstrated output RF power of 1.1 dBm at 100 GHz.
    • Accurate prediction of radiated power from 200 GHz to 260 GHz using 3D modeling.
    • First optical 3D full-wave modeling of waveguide UTCs, detailing fiber coupling.

    Conclusions:

    • SSMBE is a viable and advantageous technique for fabricating high-performance phosphide-based UTC-PDs.
    • The developed UTC-PDs exhibit excellent high-frequency performance and potential for terahertz applications.
    • 3D modeling provides accurate predictions and detailed insights into device performance and integration.