Related Experiment Video

Updated: Jan 1, 2026

In Depth Analyses of LEDs by a Combination of X-ray Computed Tomography CT and Light Microscopy LM Correlated with Scanning Electron Microscopy SEM
10:42

In Depth Analyses of LEDs by a Combination of X-ray Computed Tomography CT and Light Microscopy LM Correlated with Scanning Electron Microscopy SEM

Published on: June 16, 2016

9.6K

Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip

Jiajie Fan1,2,3,4, Jie Wu1, Changzhen Jiang2,3

  • 1Changzhou Xingyu Automotive Lighting System Co, Ltd., Changzhou 213022, China.

Materials (Basel, Switzerland)
|December 28, 2019
PubMed

Keywords:
flip chiplight-emitting dioderandomly distributed voidsreliabilitysolder joint

More Related Videos

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages08:46

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Published on: April 13, 2016

10.4K
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.8K

Related Concept Videos

Thermal Stress01:09

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
3.2K
Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
497
Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55...
2.0K