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Thermal and efficiency droop in InGaN/GaN light-emitting diodes: decoupling multiphysics effects using
Arman Rashidi1, Morteza Monavarian2, Andrew Aragon2
1Center for High Technology Materials (CHTM), University of New Mexico, Albuquerque, New Mexico, 87106, USA. arashidi@unm.edu.
Investigating thermal and efficiency droop in InGaN/GaN LEDs, this study reveals high-current droop stems from non-radiative recombination and radiative rate saturation. Elevated temperatures worsen droop by shifting carriers to non-radiative pathways.
Area of Science:
- Semiconductor physics
- Optoelectronics
- Materials science
Background:
- Thermal and efficiency droop are significant challenges in InGaN/GaN light-emitting diodes (LEDs).
- Multiphysics processes like recombination, carrier transport, and heating contribute to droop.
- A clear method to isolate these factors under electrical injection is needed.
Purpose of the Study:
- To decouple and quantify recombination, injection, transport, and thermal effects in InGaN/GaN LEDs.
- To understand the root causes of efficiency and thermal droop.
- To establish a robust methodology for analyzing III-nitride LED performance.
Main Methods:
- Utilized a comprehensive rate equation approach.
- Employed a temperature-dependent pulsed-radio frequency (RF) measurement technique.
- Investigated electrically injected single-quantum-well InGaN/GaN LEDs.
Main Results:
- Efficiency droop at high current densities is attributed to non-radiative recombination (Auger-like) and radiative rate saturation.
- Thermal droop at elevated temperatures is caused by carrier redistribution towards non-radiative processes.
- The study successfully decoupled inherent recombination dynamics.
Conclusions:
- The developed methodology provides unambiguous access to quantum well recombination dynamics.
- This approach is valuable for diagnosing efficiency limitations in III-nitride LEDs.
- Understanding these processes is crucial for improving LED performance and reliability.
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