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Updated: Dec 31, 2025

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
Long-term stability of multilayer MoS2 transistors with mica gate dielectric
Xiao Zou1, Jingping Xu2, Lu Liu2
1Department of Electromachine Engineering, Jianghan University, Wuhan 430056, People's Republic of China.
Abstract:
To avoid surface damage of a MoS2 channel, a mica flake with high permittivity and atomically flat surface was dry transferred onto a multilayer MoS2 flake to prepare top-gated transistors. For the first time, the interface properties of mica/MoS2 and the long-term stability of devices were investigated when the transistors were exposed to ambient air. Results show that the electrical performance of the transistors is degraded significantly when the devices are exposed to ambient moisture for a long time, due to the strong hydrophilism of mica. The transfer curves of the transistors cannot be recovered to their initial states even after annealing. The adsorbed moisture can become trapped at the interface between the MoS2 channel and mica dielectric or on the MoS2 surface, resulting in enhanced carrier scattering and degraded device performance. However, the top-gated MoS2 transistor with Al2O3 encapsulation exhibits enhanced stability even after annealing or exposure to atmosphere for 200 days. The excellent stability should be attributed to the effective insulation of moisture from the ambient air by Al2O3 encapsulation. Therefore, a dense and hydrophobic encapsulation layer is indispensable for stable and high-performance top-gated MoS2 transistors with mica gate dielectric.
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