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Surface Analysis of Wire-Electrical-Discharge-Machining-Processed Shape-Memory Alloys.
Rakesh Chaudhari1, Jay J Vora1, Vivek Patel1,2
1Department of Mechanical engineering, School of Technology, Pandit Deendayal Petroleum University, Raisan, Gandhinagar 382007, India.
Materials (Basel, Switzerland)
|January 26, 2020
Summary
Wire-electrical-discharge machining (WEDM) is effective for cutting nitinol, a shape-memory alloy. Optimizing WEDM parameters improves surface integrity by reducing microcracks and pores, crucial for material performance in demanding applications.
Area of Science:
- Materials Science
- Manufacturing Engineering
- Surface Engineering
Background:
- Nitinol, a shape-memory alloy, presents machining challenges due to its unique properties like superelasticity and strain hardening.
- Advanced applications in aerospace, medical, and automotive sectors necessitate precise nitinol fabrication.
- Wire-electrical-discharge machining (WEDM) offers a viable, efficient method for machining nitinol.
Purpose of the Study:
- To investigate the surface integrity of nitinol processed via WEDM.
- To analyze the impact of WEDM parameters on surface characteristics.
- To establish optimal WEDM conditions for superior nitinol surface quality.
Main Methods:
- Digital microscopy imaging for surface topography analysis.
- Scanning electron microscopy (SEM) for detailed microstructural examination.
- Energy-dispersive X-ray (EDX) analysis to determine surface composition.
Main Results:
- Surface roughness is influenced by dielectric fluid exposure during WEDM.
- Optimized WEDM parameters significantly reduce microcracks, pores, and globule density.
- EDX analysis confirmed no contamination from the WEDM wire material.
Conclusions:
- WEDM is a suitable process for machining nitinol, but careful parameter control is essential.
- Achieving desired surface roughness and minimizing defects requires precise discharge energy management.
- Optimized WEDM parameters enhance nitinol's surface integrity, critical for its performance in high-tech applications.
