Miniaturization, Triple-Line Effects, and Reactive Wetting of Microsolder Interfaces

While reactive microsolder joints are of ubiquitous importance in modern electronics, the effects of joint miniaturization on wetting behavior remain largely unexplored. We elucidate this fundamental question of scalability by investigating the wettability of eutectic SnPb solder on Cu and Ni-electrodeposited metallization strips of varying widths. Contact angles are presented in dependence of the metallization width which is varied from 3 mm down to ∼100 μm. The measured angles clearly increase with decreasing metallization width. Based on the measurements and by modifying Young's equation, it is shown that the behavior of the wetting angle can be quantitatively understood with an "effective" triple-line energy of ϵ = (753 ± 31) × 10^-9J/m for SnPb on Cu. The interpretation of this energy term is discussed in relation to the forming intermetallic phase and the ensuing surface roughness. A remarkable similarity between the experimentally observed size dependence and the crossed-groove perturbation model of Huh and Mason demonstrates that the rough intermetallic phase induces wetting hysteresis such that it is quantitatively well described by an effective triple-line energy.