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High-Loading Boron Nitride-Based Bio-Inspired Paper with Plastic-like Ductility and Metal-like Thermal Conductivity
Yunjing Wang1, Shuang Xia2, Guang Xiao1
1College of Materials Science and Engineering, Hunan University, Changsha 410082, China.
ACS Applied Materials & Interfaces
|February 22, 2020
Summary
Researchers developed a flexible, insulating paper inspired by mollusk nacre. This new boron nitride (BN) paper offers high thermal conductivity and mechanical toughness for advanced electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Composite Materials
Background:
- Fabricating flexible hybrid films with integrated mechanical, thermal, and electrical properties is challenging for next-generation electronics.
- Mollusk nacre utilizes a chitin nanofiber framework to host CaCO3 microplatelets, achieving high-loading composites with ductile behavior.
Purpose of the Study:
- To create a bio-inspired, boron nitride-based paper with excellent mechanical and thermal properties for flexible electronics.
- To mimic nacre's structure for high-performance composite material fabrication.
Main Methods:
- A facile sol-gel-film conversion approach was used to embed boron nitride (BN) microplatelets into a 3D poly(p-phenylene benzobisoxazole) nanofiber framework.
- The resulting BN-based paper contained 40-80 wt% BN microplatelets.
Main Results:
- The BN-based paper demonstrated plastic-like ductility (38-80%), ultrahigh toughness (10-100 MJ m⁻³), and good folding endurance due to the 3D nanofiber framework.
- An oriented, percolative network of BN platelets resulted in outstanding in-plane thermal conductivity (77.1-214.2 W m⁻¹ K⁻¹), comparable to aluminum alloys.
- The material functions as an electrically insulating flexible substrate.
Conclusions:
- The bio-inspired BN paper successfully integrates ductility, toughness, and high thermal conductivity while remaining electrically insulating.
- This material shows significant promise as a flexible substrate for thermal management in electronic devices.

