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Updated: Dec 25, 2025

Epitaxial Nanostructured α-Quartz Films on Silicon: From the Material to New Devices

Epitaxial Nanostructured α-Quartz Films on Silicon: From the Material to New Devices

Published on: October 6, 2020

Research on a Micro-Processing Technology for Fabricating Complex Structures in Single-Crystal Quartz.

Chao Han¹, Cun Li¹, Yulong Zhao¹

¹State Key Laboratory for Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an 710049, China.

|March 28, 2020

Summary

This summary is machine-generated.

A new quartz-on-silicon (QoS) method combined with inductively coupled plasma (ICP) etching enables complex single-crystal quartz structures. This fabrication technique overcomes processing challenges for hard quartz materials, yielding ultra-thin wafers and 3D designs.

Keywords:

ICP etching bonding quartz on silicon (QoS)

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Last Updated: Dec 25, 2025

Epitaxial Nanostructured α-Quartz Films on Silicon: From the Material to New Devices

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Published on: March 11, 2022

Area of Science:

Materials Science
Microfabrication
Crystallography

Background:

Single-crystal quartz is crucial for resonators and sensors but difficult to machine due to its hardness.
Conventional processing methods for quartz are limited, especially for complex structures and varying crystal orientations.

Purpose of the Study:

To introduce a novel fabrication method for complex single-crystal quartz structures.
To overcome the processing limitations of hard quartz materials using advanced microfabrication techniques.

Main Methods:

The proposed method integrates quartz-on-silicon (QoS) technology with inductively coupled plasma (ICP) dry etching.
QoS involves bonding quartz to silicon, thinning the quartz layer, and then etching it using ICP.
The underlying silicon wafer is subsequently removed to yield the pure quartz structure.

Main Results:

Fabrication of ultra-thin Z-cut single-crystal quartz wafers with thicknesses below 40 μm.
Creation of complex three-dimensional quartz structures with feature widths as small as 80 μm using ICP etching.
Demonstration of a method overcoming challenges in processing single-crystal quartz with different crystal orientations.

Conclusions:

The developed QoS and ICP etching technique provides a feasible route for fabricating intricate single-crystal quartz components.
This method facilitates the production of advanced quartz-based sensors and actuators, including quartz resonant accelerometers.