Related Experiment Video
Updated: Dec 25, 2025
Hybrid Printing for the Fabrication of Smart Sensors
Published on: January 31, 2019
Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink
Ning Wang1,2, Yangai Liu1, Wei Guo2
1Beijing Key Laboratory of Materials Utilization of Nonmetallic Minerals and Solid Wastes, National Laboratory of Mineral Materials, School of Materials Science and Technology, China University of Geosciences, Beijing 100083, People's Republic of China.
None:
In this study, a transparent particle-free reactive silver ink was used to fabricate conductive patterns on a flexible substrate. Thermal annealing and plasma irradiation at low temperature were utilized to improve the conductivity of the as-printed patterns. The effects of sintering process parameters on the microstructure and resistivity of the patterns were investigated. Under the optimized processing conditions, the resistivity of the pattern reached 1.2 × 10 -7 Ω · m by thermal sintering, while it was 8 × 10 -8 Ω · m after plasma sintering. Combined with these two sintering techniques, the resistivity was reduced to 6 × 10-8 Ω · m, close to that of bulk silver. This work provides an alternative solution for the fabrication of highly conductive feature patterns on common flexible substrates.
