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Deep Learning Enabled Strain Mapping of Single-Atom Defects in Two-Dimensional Transition Metal Dichalcogenides with
Chia-Hao Lee1, Abid Khan2, Di Luo2
1Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, United States.
Nano Letters
|April 4, 2020
Summary
We developed a deep learning method to precisely measure atomic strain fields in 2D materials like WSe2Te2. This technique overcomes radiation damage limitations in electron microscopy, revealing defect-induced lattice changes with sub-picometer accuracy.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Nanotechnology
Background:
- Two-dimensional (2D) materials are excellent for studying atomic defects, but radiation damage hinders electron microscopy.
- Probing atomic-scale strain fields around defects is crucial for understanding material properties.
Purpose of the Study:
- To develop a high-precision method for analyzing atomic-scale strain fields induced by single-atom defects in 2D materials.
- To overcome limitations of electron microscopy caused by radiation damage in beam-sensitive materials.
Main Methods:
- Utilized deep learning algorithms to analyze large datasets of aberration-corrected scanning transmission electron microscopy (STEM) images.
- Developed a technique to generate high signal-to-noise class averages from hundreds of defect images.
- Achieved sub-picometer precision in measuring 2D atomic spacings.
Main Results:
- Successfully probed single-atom defects in monolayer WSe2Te2 with sub-picometer precision.
- Identified complex, oscillating strain fields around selenium (Se) vacancies.
- Observed alternating rings of lattice expansion and contraction induced by Se vacancies.
Conclusions:
- Demonstrated the potential of computer vision and deep learning for high-precision electron microscopy of beam-sensitive 2D materials.
- Revealed intricate strain field patterns around atomic defects, offering new insights into material behavior.
- Paved the way for advanced characterization of defects in novel 2D materials.

