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Solid-state Graft Copolymer Electrolytes for Lithium Battery Applications
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Garnet-Based All-Ceramic Lithium Battery Enabled by Li2.985B0.005OCl Solder
Wuliang Feng1, Zhengzhe Lai1, Xiaoli Dong1
1Department of Chemistry and Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials, Institute of New Energy, Fudan University, Shanghai 200433, China.
Iscience
|May 4, 2020
Summary
This study introduces a novel Li2.985B0.005OCl sintering solder for safer, high-performance all-ceramic lithium batteries (ACLBs). The solder significantly reduces interfacial resistance and improves cycling stability in garnet-based ACLBs.
Area of Science:
- Materials Science
- Electrochemistry
- Solid-State Chemistry
Background:
- All-ceramic lithium batteries (ACLBs) offer enhanced safety but suffer from high cathode/electrolyte interfacial resistance.
- Garnet-based ACLBs face performance limitations due to interfacial issues between LiCoO2 cathodes and Li7La3Zr2O12 electrolytes.
Purpose of the Study:
- To develop a sintering solder for improving the electrochemical performance of garnet-based bulk-type ACLBs.
- To address the challenge of high interfacial resistance in ACLBs through in situ coating techniques.
Main Methods:
- In situ coating of Li2.985B0.005OCl on LiCoO2 and Li7La3Zr2O12 components.
- Hot-press sintering to densify the all-ceramic lithium battery structure.
- Characterization of interfacial resistance and electrochemical performance.
Main Results:
- Uniform coating of Li2.985B0.005OCl with low melting point (267°C) and high ionic conductivity (6.8 × 10^-5 S cm^-1).
- Reduced cathode/electrolyte interfacial resistance to 386 Ω cm^2.
- Suppressed La/Co interdiffusion and enhanced Li+ transportation.
- Improved cycling stability due to strain/stress release in LiCoO2.
Conclusions:
- Li2.985B0.005OCl serves as an effective sintering solder for garnet-based bulk-type ACLBs.
- The developed method significantly enhances interfacial properties and electrochemical stability.
- This approach provides insights for designing advanced ACLBs using optimized solders.
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