Study on Electrical Explosion Properties of Cu/Ni Multilayer Exploding Foil Prepared by Magnetron Sputtering and...

Area of Science:

• Materials Science
• Electrical Engineering
• Physics

Background:

• Microstructure and properties of Cu/Ni multilayer films significantly influence their electrical explosion performance.
• Magnetron sputtering (MS) and electroplating (EP) are common methods for preparing thin films, each with distinct microstructural outcomes.

Purpose of the Study:

• To investigate how the microstructure and properties of Cu/Ni multilayer films, prepared by MS and EP, affect their electrical explosion performance.
• To compare the electrical explosion characteristics of Cu/Ni multilayer films fabricated using EP versus MS.

Main Methods:

• Cu/Ni multilayer films were prepared using electroplating (EP) and magnetron sputtering (MS).
• Morphology and crystal structure were characterized using scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray diffraction (XRD).
• Electrical explosion performance was tested using a dedicated system, analyzing resistance-time and energy-resistance curves.

Main Results:

• EP films exhibited smaller crystal sizes and clearer Cu/Ni interfaces compared to MS films.
• MS samples showed earlier burst times, higher peak resistances, lower peak energies, and higher ionization voltages during electrical explosion.
• Thicker mixing layers in the multilayer films led to more energy distribution on Ni, faster resistance increase, and higher energy conversion efficiency.

Conclusions:

• The preparation method (EP vs. MS) critically impacts the microstructure and subsequent electrical explosion behavior of Cu/Ni multilayer films.
• EP-prepared films demonstrate superior characteristics for electrical explosion applications due to finer microstructure and distinct interfaces.
• Understanding the role of the mixing layer thickness is crucial for optimizing energy conversion efficiency in exploding foil applications.