Review of Power Electronics Components at Cryogenic Temperatures

Area of Science:

• Materials Science
• Electrical Engineering
• Cryogenics

Background:

• Power electronics systems are increasingly used in cryogenic applications like superconducting systems.
• Understanding component behavior at low temperatures is crucial for reliable system design.
• Existing research on cryogenic performance of power electronics is fragmented.

Purpose of the Study:

• To comprehensively review the influence of cryogenic temperatures on various power electronics components.
• To identify materials and components suitable for operation in cryogenic environments.
• To provide theoretical insights into the behavior of cryogenically cooled converters.

Main Methods:

• Literature review of power semiconductor devices (Si and wide bandgap switches).
• Analysis of integrated circuits, passive components, and interconnection/dielectric materials.
• Examination of typical cryogenic converter systems and underlying principles.

Main Results:

• Silicon (Si) active power devices and bulk CMOS integrated circuits show suitability for cryogenic operation.
• Nanocrystalline/amorphous magnetic cores, NP0 ceramic/film capacitors, and specific resistors are identified as cryogenically viable passive components.
• Pb-rich PbSn or In solder, classic PCB materials, insulation papers, and epoxy encapsulants are suitable for cryogenic interconnections and dielectrics.

Conclusions:

• Specific silicon-based devices, passive components, and interconnection materials are well-suited for cryogenic power electronics applications.
• The findings guide the selection of components for reliable operation in low-temperature environments.
• This review provides a foundational understanding for designing advanced cryogenic power systems.