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Thermally Conductive Elastomer Composites with Poly(catechol-polyamine)-Modified Boron Nitride.

Xinyang Liu1, Qiaoyu Han1, Dan Yang1,2

  • 1Department of Materials Science and Engineering, Beijing Institute of Petrochemical Technology, Beijing 102617, China.

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|June 23, 2020
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Summary

This study enhances thermal conductivity in polymer composites using modified boron nitride (BN) platelets. The poly(catechol-polyamine) (PCPA) coating improves filler-matrix compatibility, boosting heat dissipation for electronics.

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Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Nanotechnology

Background:

  • Effective heat dissipation is critical for microelectronic devices.
  • Polymer composites often use thermally conductive fillers to improve thermal conductivity.
  • Interfacial compatibility between fillers and polymer matrices is key to performance.

Purpose of the Study:

  • To enhance the thermal conductivity of carboxylated acrylonitrile-butadiene rubber (XNBR) composites.
  • To investigate the effect of poly(catechol-polyamine) (PCPA) coating thickness on BN platelets.
  • To explore the potential applications in electronic packaging.

Main Methods:

  • Modification of boron nitride (BN) platelets with poly(catechol-polyamine) (PCPA) to create BN-PCPA.
  • Fabrication of XNBR composites filled with BN-PCPA platelets.
  • Systematic study of the influence of PCPA thickness on composite properties.

Main Results:

  • Increased PCPA thickness improved interfacial compatibility between BN-PCPA and the XNBR matrix.
  • Thermal conductivity of the composites was enhanced with increasing PCPA thickness.
  • The BN-PCPA-12h/XNBR composite achieved a maximum thermal conductivity of 0.399 W/(m·K), a 2.5-fold increase over pure XNBR.

Conclusions:

  • PCPA modification of BN platelets is an effective strategy to enhance thermal conductivity in polymer composites.
  • The developed composites show potential for practical applications in electronic packaging due to high thermal conductivity and dielectric constant.