Microfluidic Encapsulation of Phase-Change Materials for High Thermal Performance

Xing Han1,2, Tiantian Kong3, Pingan Zhu1,2

  • 1Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR 999077, China.

Summary

Microfluidic encapsulation precisely fabricates microencapsulated phase-change materials (MEPCMs) with tunable thermal properties. This method offers superior performance for applications like anticounterfeiting.

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