Feasibility Study of an Automated Assembly Process for Ultrathin Chips

This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.