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3D printable tough silicone double networks.

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Researchers developed advanced silicone double networks (SilDNs) for 3D printing. These materials enable precise control over soft device fabrication and mechanical properties, allowing bonding to diverse substrates.

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Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Additive Manufacturing

Background:

  • Additive manufacturing offers novel soft device designs but faces material limitations and challenges in joining dissimilar components.
  • Existing methods struggle to independently control the 3D printing process and the final mechanical characteristics of soft materials.

Purpose of the Study:

  • To introduce silicone double networks (SilDNs) with orthogonal crosslinking mechanisms for enhanced control over soft device fabrication.
  • To enable independent tuning of shape-forming (3D printing) and mechanical properties of soft materials.
  • To achieve robust adhesion between 3D printed soft materials and substrates with vastly different mechanical properties.

Main Methods:

  • Utilized orthogonal crosslinking: photocurable thiol-ene reactions for 3D printing and condensation reactions for final properties and bonding.
  • Synthesized silicone double networks (SilDNs) exhibiting specific mechanical properties like low elastic modulus, high toughness, and large ultimate strains.
  • Demonstrated cohesive bonding of printed SilDNs to substrates with modulus gradients spanning over seven orders of magnitude.

Main Results:

  • SilDNs exhibited a low elastic modulus (<700 kPa) alongside high toughness (~1.4 MJ·m⁻³) and strength (~1 MPa).
  • Achieved large ultimate strains up to ~400% (dL/L₀).
  • Successfully bonded 3D printed objects to substrates with extreme modulus differences using latent condensation reactions.

Conclusions:

  • Silicone double networks (SilDNs) provide independent control over 3D printing and mechanical properties through orthogonal crosslinking.
  • The developed SilDNs offer a versatile platform for fabricating sophisticated soft devices, including tissue models and wearable electronics.
  • This approach overcomes limitations in joining dissimilar materials, paving the way for advanced soft robotics and biomedical applications.