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Metal-Semiconductor-Metal GeSn Photodetectors on Silicon for Short-Wave Infrared Applications
Soumava Ghosh1,2,3, Kuan-Chih Lin2, Cheng-Hsun Tsai2
1Department of Mechanical Engineering, and Advanced Institute of Manufacturing with High-Tech Innovations (AIM-HI), National Chung Cheng University, Chiyai County 62102, Taiwan.
Germanium-tin metal-semiconductor-metal photodetectors (GeSn MSM PDs) offer broad spectral coverage up to 1800 nm for telecommunication bands. These devices are suitable for short-wave infrared applications due to enhanced responsivity with bias voltage.
Area of Science:
- Optoelectronics
- Materials Science
- Photonics
Background:
- Metal-semiconductor-metal photodetectors (MSM PDs) are crucial for monolithic integration in photonic circuits due to their planar fabrication.
- Germanium-tin (GeSn) alloys offer tunable bandgaps for infrared applications.
Purpose of the Study:
- To design, grow, and characterize GeSn MSM PDs for photonic integrated circuits.
- To investigate the effect of tin incorporation on the optical responsivity of GeSn MSM PDs.
Main Methods:
- Fabrication of GeSn MSM PDs with 4% tin incorporation.
- Optical characterization of spectral responsivity and its dependence on bias voltage.
Main Results:
- GeSn MSM PDs exhibit redshifted optical responsivity extending to 1800 nm, covering telecommunication bands.
- Spectral responsivity increases with bias voltage due to enhanced carrier generation and collection efficiency.
Conclusions:
- GeSn MSM PDs are suitable for photonic integrated circuits and short-wave infrared (SWIR) applications.
- The tunable bandgap of GeSn alloys enables broadband photodetection capabilities.
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