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Temperatures in the pulpal cavity during orthodontic bonding using an LED light curing unit : An in vitro pilot study
Anna-Lena Groddeck1,2, Rainer Schwestka-Polly3, Hartmut Hecker4
1Department of Orthodontics, Hannover Medical School, Carl-Neuberg-Straße 1, 30625, Hannover, Germany. a.nitzschmann@gmx.de.
Summary
High-intensity light curing units can cause significant pulpal temperature increases during bracket bonding. This study measured temperature rises in extracted teeth, revealing potential risks with current LED curing protocols.
Area of Science:
- Dental materials science
- Biomaterials engineering
- Clinical dentistry
Background:
- Patients undergoing bracket bonding often report thermal sensitivity.
- Modern Light Emitting Diode (LED) curing units can reach intensities up to 3200 mW/cm².
- The thermal effects of these high-intensity units on pulpal temperature are not fully understood.
Purpose of the Study:
- To investigate the intrapulpal temperature increase during bracket bonding using LED light curing units.
- To assess the impact of different parameters (hygienic barriers, light exposure frequency, distance) on temperature rise.
- To evaluate the clinical relevance of manufacturer recommendations for LED curing units.
Main Methods:
- Sixty extracted teeth (incisors, premolars, molars) were used in an in vitro study.
- Temperature increase was measured starting from 37°C.
- Tests were conducted with and without a hygienic barrier, with single or double light exposure, and at 3mm and 4mm distances.
- Metal brackets were bonded in a subsequent test series.
Main Results:
- Significant intrapulpal temperature increases were observed across all test series.
- The highest temperatures occurred with single light exposure without a hygienic barrier.
- Temperatures exceeded 42.5°C in lower incisors and premolars under specific conditions.
Conclusions:
- Bracket bonding with LED curing units, following manufacturer recommendations, can lead to significant pulpal temperature increases (up to 42.5°C).
- The study suggests a need to critically re-evaluate current manufacturer recommendations for LED light curing unit usage.
- Further research is warranted to optimize protocols and mitigate thermal risks during orthodontic bracket bonding.

