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Computational proximity lithography with extreme ultraviolet radiation.

Valerie Deuter, Maciej Grochowicz, Sascha Brose

    Optics Express
    |September 10, 2020
    PubMed
    Summary

    Extreme ultraviolet (EUV) computational proximity lithography enables arbitrary nanoscale pattern fabrication using a novel holographic mask. This method bypasses the need for high-resolution imaging optics for non-periodic structures.

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    Area of Science:

    • Nanotechnology
    • Lithography
    • Optics

    Background:

    • Fabricating arbitrary nanoscale patterns is crucial for advanced electronics and photonics.
    • Conventional lithography techniques often require complex and expensive high-resolution imaging optics.
    • Existing methods struggle with printing non-periodic structures efficiently.

    Purpose of the Study:

    • To investigate the potential of extreme ultraviolet (EUV) computational proximity lithography for fabricating arbitrary nanoscale patterns.
    • To propose and evaluate a novel holographic mask approach for EUV lithography.
    • To assess the imaging performance of this method under different spatial coherence conditions.

    Main Methods:

    • Utilized a holographic mask (attenuating phase shifting mask) with two phase levels.
    • Designed the mask for a 13.5 nm wavelength using a 50 nm pixel size electron beam resist.
    • Evaluated imaging performance using EUV radiation from both synchrotron undulator and laboratory plasma sources with varying spatial coherence.

    Main Results:

    • Demonstrated the feasibility of fabricating arbitrary, non-periodic nanoscale patterns.
    • The holographic mask approach successfully printed patterns without high-resolution imaging optics.
    • Imaging performance was assessed using different EUV radiation sources and coherence levels.

    Conclusions:

    • EUV computational proximity lithography with holographic masks offers a promising route for arbitrary nanoscale pattern fabrication.
    • This method eliminates the requirement for complex imaging optics, potentially reducing fabrication costs.
    • The technique shows potential for diverse applications in nanotechnology and semiconductor manufacturing.