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Updated: Dec 9, 2025

Author Spotlight: Real-Time Imaging of Bonding in 3D-Printed Layers
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Capacitive imaging for adhesive bonds and quality evaluation.

Xuhui Huang1, Ciaron Hamilton1, Zonglin Li1

  • 1Nondestructive Evaluation Laboratory, Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI 48824, USA.

Philosophical Transactions. Series A, Mathematical, Physical, and Engineering Sciences
|September 14, 2020
PubMed
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Investigating adhesive bond quality, this study explores electrical property discontinuities at interfaces. Capacitive imaging reveals how these discontinuities simulate defects, aiding in understanding degraded adhesion.

Area of Science:

  • Materials Science
  • Non-Destructive Testing
  • Electrical Engineering

Background:

  • Defective adhesive bonds compromise structural integrity and joint strength.
  • Understanding adhesion phenomena is crucial across various scientific and technological fields.
  • Discontinuities in material properties at interfaces significantly impact bond quality.

Purpose of the Study:

  • To investigate the relationship between electrical property discontinuities at adhesive-substrate interfaces and bond quality.
  • To explore the potential of capacitive imaging for non-destructive evaluation of adhesive joints.
  • To develop a simplified model for analyzing interface properties without complex multidisciplinary knowledge.

Main Methods:

  • Focusing on discontinued electrical properties at the adhesive-substrate interface.
Keywords:
adhesive bondscapacitive imagingcoplanar electrode sensorelectrostatic simulation model

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  • Utilizing capacitive imaging (CI) to measure dielectric properties.
  • Simulating defects by analyzing abrupt changes in electric field distribution due to permittivity uncertainties.

    • Main Results:

    • Abrupt changes in dielectric property discontinuity at the interface alter capacitance measurements.
    • Capacitive imaging shows promise for detecting simulated defects in adhesive joints.
    • The study establishes a link between electrical properties and non-destructive measurements.

    Conclusions:

    • Discontinuities in dielectric properties at adhesive interfaces are key indicators of bond quality.
    • Capacitive imaging offers a viable non-destructive method for evaluating adhesive bond integrity.
    • Further research can enhance understanding of degraded adhesion through electrical property analysis.