Modeling the Adhesion Bonding Strength in Injection Overmolding of Polypropylene Parts

In this work, the bonding strength of overmolded polypropylene is investigated and modeled. A T-joint specimen was designed to replicate the bonding between a base and an overmolded stem made of the same polymer: a previously molded plaque was used for the base, and the stem was directly overmolded. The effect of melt temperature, holding pressure, and localized heating was investigated following the design of experiments approach. Both the melt and base temperature positively affect the welding strength. On the contrary, the holding pressure negatively contributed, as the crystallization temperature significantly increases with pressure. Then, the bonding strength of the specimens was predicted using a non-isothermal healing model. Moreover, the quadratic distance of diffusion (based on the self-diffusion model) was calculated and correlated with the bonding strength prediction. The non-isothermal healing model well predicts the bonding strength when the reptation time is calculated within the first 0.09 s of the interface temperature evolution. The prediction error ranges from 1% to 35% for the specimens overmolded at high and low melt and base temperatures, respectively.