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Accelerated Bottom-Up Gold Filling of Metallized Trenches.

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This study demonstrates void-free, bottom-up gold electrodeposition in high-aspect-ratio trenches using a novel electrolyte. Researchers explored strategies to improve deposition speed and analyzed the resulting gold grain structures.

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Area of Science:

  • Electrochemistry
  • Materials Science
  • Nanotechnology

Background:

  • Void-free, bottom-up feature filling is crucial for microelectronic fabrication.
  • Previous work established this technique in specific electrolytes with Bi3+ additives.
  • High-aspect-ratio trenches present challenges for uniform material deposition.

Purpose of the Study:

  • To demonstrate void-free, bottom-up electrodeposition in high-aspect-ratio trenches (>10).
  • To explore strategies for reducing the incubation period of deposition.
  • To characterize the microstructure of electrodeposited gold using electron backscatter diffraction.

Main Methods:

  • Utilized a near-neutral Na3Au(SO3)2 + Na2SO3 electrolyte with micromolar Bi3+.
  • Employed potentiostatic, stepped potential, and/or stepped current control.
  • Conducted electron backscatter diffraction (EBSD) analysis on filled trenches.

Main Results:

  • Achieved void-free, bottom-up filling in 17 µm and 45 µm tall trenches.
  • Investigated methods to accelerate deposition initiation on passivated surfaces.
  • Observed large, trench-spanning gold grains (tens of micrometers) in filled deposits.
  • Identified smaller grains near trench tops and mid-height under marginal filling conditions.

Conclusions:

  • Demonstrated successful bottom-up electrodeposition in challenging high-aspect-ratio geometries.
  • Provided insights into controlling deposition kinetics and microstructure.
  • EBSD analysis revealed distinct grain morphologies correlating with filling conditions.