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Automated Nanoscale Absolute Accuracy Alignment System for Transfer Printing.

John McPhillimy1,2, Dimitars Jevtics1, Benoit J E Guilhabert1

  • 1Institute of Photonics, SUPA Department of Physics, University of Strathclyde, Glasgow, United Kingdom.

ACS Applied Nano Materials
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Summary

Automated nanoscale transfer printing enables scalable manufacturing of integrated chip systems. This process achieves high positional and rotational accuracy for micro- and nanoscale devices, crucial for telecommunications and quantum computing applications.

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Area of Science:

  • Nanotechnology
  • Materials Science
  • Electrical Engineering

Background:

  • Heterogeneous integration of micro/nanoscale devices with on-chip circuits is vital for advanced applications like telecommunications, quantum information processing, and sensing.
  • Previous nanoscale pick-and-place integration methods lacked automation, hindering scalability for multielement systems and high-throughput manufacturing.

Purpose of the Study:

  • To develop an automated transfer printing process for nanoscale integration that maintains high accuracy.
  • To demonstrate the feasibility of automated, high-precision placement of micro- and nanoscale devices for scalable manufacturing.

Main Methods:

  • An automated transfer printing system was developed using optical microscopy, computer vision, and a high-accuracy translational stage.
  • Cross-correlation image processing was employed for automatic alignment and precise device placement.
  • The process was tested for both serial and parallel transfer of thin film silicon membranes and single nanowires.

Main Results:

  • Serial device integration achieved an average positional offset of <40 nm (3σ < 390 nm).
  • Parallel transfer across a 2x2 mm^2 area demonstrated an average offset of <30 nm (3σ < 705 nm).
  • Rotational accuracy better than 45 mrad was consistently achieved for various device types.

Conclusions:

  • The automated transfer printing method successfully integrates micro- and nanoscale devices with high accuracy and automation.
  • This technology enables scalable manufacturing of complex heterogeneously integrated chip systems.
  • The demonstrated process is compatible with devices from both defined and random distributions, paving the way for industrial adoption.