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Diamond-Like-Carbon Coated Dies for Electromagnetic Embossing.

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Electromagnetic forming enables contactless punching and microstructure embossing on thin sheets. Applying an amorphous hydrogenated carbon-Physical Vapor Deposition (a-C:H-PVD) coating to steel dies prevents adhesion and improves embossing quality.

Keywords:
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Area of Science:

  • Manufacturing Engineering
  • Materials Science

Background:

  • Electromagnetic forming (EMF) is a high-speed, contactless process ideal for microstructuring thin sheet metals.
  • Die design is critical in EMF, with adhesion being a significant challenge across various die materials like aluminum, copper, and steel.

Purpose of the Study:

  • To investigate methods for preventing die adhesion during electromagnetic forming.
  • To evaluate the effectiveness of amorphous hydrogenated carbon-Physical Vapor Deposition (a-C:H-PVD) coatings on steel dies.
  • To analyze the influence of die surface structuring and initial sheet properties on embossing quality.

Main Methods:

  • Testing various die materials (Al, Cu, steel) for adhesion during EMF.
  • Applying a-C:H-PVD coatings to X153CrMoV12 steel dies.
  • Structuring coated dies with micro hard milling to create tribology-effective patterns.
  • Embossing Al99.5 sheets using coated and structured dies.
  • Topographical analysis of embossed microstructures and assessment of sheet surface influence.

Main Results:

  • Adhesion phenomena were observed for all tested conventional die materials.
  • The a-C:H-PVD coating effectively prevented adhesion on steel dies.
  • Tribology-effective patterns on the die surface influenced embossing quality.
  • Thicker sheets and specific initial surface topographies of the sheets resulted in better embossing outcomes.

Conclusions:

  • a-C:H-PVD coatings are a viable solution to mitigate die adhesion in electromagnetic forming.
  • Die surface engineering, including patterning and material selection, is crucial for successful microstructure embossing.
  • Initial sheet properties significantly impact the quality and feasibility of EMF microstructuring.