Photonic integrated circuits based hybrid integration for wavelength beam combining

Area of Science:

• Photonics
• Optical Engineering
• Semiconductor Devices

Background:

• Traditional laser combining systems are often bulky, heavy, and power-intensive.
• Photonic integrated circuits (PICs) offer miniaturization potential for optical systems.
• Hybrid integration combines different material platforms to leverage their unique advantages.

Purpose of the Study:

• To demonstrate wavelength beam combining (WBC) using hybrid integration of PICs.
• To significantly reduce the size, weight, and power consumption of laser combining systems.
• To explore the use of semiconductor optical amplifiers (SOAs) and silicon nitride PICs for laser development.

Main Methods:

• Hybrid integration of III/V semiconductor optical amplifiers (SOAs) with silicon nitride PICs.
• Utilizing an arrayed waveguide grating (AWG) as the external cavity to define lasing wavelength.
• Fabricating and characterizing the hybrid laser system.

Main Results:

• Successful demonstration of wavelength beam combining (WBC) through hybrid integration.
• The AWG-based hybrid laser effectively defines the lasing wavelength via its passband.
• Multiple channel lasers were formed by combining SOAs on the hybrid platform.
• Significant reduction in size, weight, and operation power compared to conventional systems.

Conclusions:

• Hybrid integration of PICs and SOAs is a viable approach for compact laser systems.
• AWG-based external cavities enable precise wavelength control in hybrid lasers.
• This technology paves the way for smaller, more efficient laser combining systems.